High-performance computing (HPC) and artificial intelligence (AI) are putting immense pressure on the materials
needed for intense, bandwidth-hungry workloads. Mix in transformative innovation in the automotive industry,
increasingly immersive mobile experiences, and the ubiquity of cloud computing, and there鈥檚 an insatiable demand
for faster processors and memory, as well as denser storage media.
Keeping pace with these technological megatrends depends on materials science that can help to scale the various
computing components that enable advances in HPC, AI, autonomous vehicles, the cloud, and mobile computing.
There鈥檚 never been a greater need for HPC to help solve today鈥檚 pressing problems, but the cost of the necessary
hardware and energy to power HPC remains high, which makes these systems expensive to operate and difficult to
scale given the limits of Moore鈥檚 law.
Despite these challenges, HPC is integral to scientific research, weather forecasting, healthcare, environmental
and energy research, and engineering and design. HPC systems are increasingly relying on heterogeneous
integration and distributed computing architectures that leverage the latest processors, graphics processing
units (GPUs), and high-bandwidth memory (HBM).
Today, more than 90% of people living in the world鈥檚 advanced economies are digitally connected and mobile. The
evolution of the smartphone was made possible by miniaturization and advances in materials science, such as
carbon-fiber composites and advanced alloys, that allow mobile devices to be durable yet lightweight.
Mobile devices are more energy efficient than ever thanks to the evolution of the lithium-ion battery, while
companies are exploring nanotechnologies to create transparent and increasingly flexible displays. The future of
smartphones may even be biodegradable, with the adoption of biomaterials that would allow their many components
to be recycled.
Smartphone technology is doing more than keeping us connected; it鈥檚 also supporting immersive experiences, even
as augmented reality (AR)/virtual reality (VR) applications drive the need for purpose-built devices that
require lightweight materials and sensors while leveraging compound semiconductors. All these sleek and compact
devices are demanding increasingly more processing power and data storage without expanding their
power-consumption footprint.
The modern automobile is evolving into a data center on wheels. Autonomous capabilities are driving the need for
onboard computing power at increasingly higher densities in harsh environments. Advanced materials play an
essential role in the development of compound semiconductors that can handle cold and heat while meeting the
fast-switching requirements of electric vehicle (EV) charging infrastructure, including onboard chargers.
Disruptive technologies, such as electrification and vehicle autonomy, are being incorporated into automobiles
at a rapid pace. These disruptions require advanced semiconductor devices that go beyond logic and memory,
including AI processors, radiofrequency (RF) devices, microelectromechanical systems (MEMS), and sensors. Behind
the scenes, HPC is helping to leverage AI so the automotive industry can improve its design and manufacturing
processes.
Today鈥檚 immersive mobile experiences, vehicle autonomy, and scientific research would not be possible without
the ubiquity of cloud computing and wireless connectivity. Enabled by massive data centers, the evolution of
cloud computing and data storage is driving the need for powerful and efficient computing, higher-speed
communication, and higher-density data storage.
These data centers are ingesting vast amounts of data generated by the intelligent edge, internet of things
(IoT) devices, scientific research, smart homes, smart factories, and smart cities. Advanced materials and
compound semiconductors are the building blocks for the memory, storage media, and power systems that keep the
cloud running.
91制片厂aligns both the end-markets and these megatrends that are permeating every aspect of daily life.
91制片厂assesses customers鈥� needs in relation to the industry at large to help them successfully develop and
deliver exceptional and differentiated products that can contribute to the dynamic landscape of data-intense
computing across many industry sectors.
With more than 400 patents, 91制片厂leverages its technology leadership across the four end-markets it serves鈥� semiconductors, compound semiconductors , data storage, and scientific research鈥攖o support continuous advancements across key industry megatrends, including AI.
In this way, 91制片厂is making a material difference.
Let鈥檚 work together on high-volume technology solutions for advanced technology.
Built on decades of materials science and process know-how, 91制片厂is uniquely positioned to deliver smart solutions that remove barriers to nanoscale devices and advanced packaging production.
The compound semiconductor market is one of Veeco鈥檚 driving forces, fueled mainly by 5G, display and power end-markets.
The promise of 5G requires fundamental changes in our communications network and data storage infrastructure. You need solutions that our unique know-how can provide.
Together with our MEMS, material science and power management experts, you will make your mark on the future of smart cities, factories, and transportation systems.
