Data storage manufacturers can dramatically increase yield of 80Gb/in2 sensors, as well as meet the demands of future TFMH device fabrication with Veeco’s third-generation NEXUS® Ion Beam Deposition (IBD) System.

• Supports wide range of devices, from current CIP to advanced CPP devices
• Ideal for MRAM applications as well as GMR and TMR thin film magnetic heads
• Improved CD control for all collimated deposition applications
• Sharper takeoff angle through symmetrical arrival of the deposition plume
• Platform easily integrated with PVD, IBE and other technologies

Veeco’s Frank Cerio, Ph.D., a leading process development engineer, presented at the IEEE International Interconnect Technology Conference (IITC). The presentation, Microstructural Optimization of Tungsten for Low Resistivity Using Ion Beam Deposition, was also presented as a poster. Watch now:

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Photomask manufacturing demands the highest levels of particle control while depositing sophisticated multiple-layer film structures. This challenge is met with Veeco’s Nexus IBD-LDD Ion Beam Deposition System. 91ÖÆƬ³§has successfully served the photomask market since the 1990s, and the years of learning have resulted in today’s state-of-the-art system. The IBD-LDD system is ideal for today’s Molybdenum (Mo) and Silicon (Si) multilayer deposition and Ruthenium (Ru) capping layer deposition on EUV mask blanks, and other mask applications requiring low defect levels and advanced thin films.

• • Production-proven platform
  • Lowest defect density
  • Excellent uniformity and repeatability
  • High reflectivity
  • Deposit multiple materials in same chamber
  • Can be integrated into other process modules into a cluster tool

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