Ideally suited to surface pre-clean, assisted deposition and select etch applications, the Mark I+ gridless ion source provides a high beam current designed for vacuum coating processes, improving process uniformity and preventing substrate damage.

• Designed for vacuum coating processes in systems of 750mm diameter or less
• Effective for use with applications requiring high-current, low-energy ions
• High beam current especially useful for controlling film stress and stoichiometry
• Also well-suited to industrial processes, including reactive environments
• Mark Series Ion Source Controller (available separately) complements source performance and provides stable and reliable process operation

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Dramatically increased beam current and a removable anode assembly adds new value to the Mark II+ End-Hall Ion Source, providing an evolutionary improvement to Veeco’s industry-leading line of gridless ion sources for optical coating systems.

• Up to 70 percent greater beam current for higher-rate processes and larger chambers
• Removable anode assembly enables quicker maintenance and less downtime
• Integrated feedthroughs and cabling for ease-of-installation and reliability
• Suitable for reactive and inert gases and high-power densities
• Smaller form factor uses same mounting plate as Mark II sources for faster upgrades
• Flexible integration permits space-saving system design and broad beam angle

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Maximize ion source performance and thin film etch, cleaning and deposition uniformity with the Mark II+ Ion Source Controller. Engineered by 91ÖÆƬ³§to specifically match the plasma characteristics of End-Hall ion sources, it helps ensure highly productive process runs and precise control of ion beam output.

• State-of-the-art switching supplies
• Integrated gas control
• Automated arc recovery
• User-friendly graphical interface and automation features enhance process productivity
• Deliver stable and reliable power for highly uniform and stable ion beam processes

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The Mark II+ Gridless High Output Ion Source features a hollow cathode and is designed for vacuum coating processes in chambers from 70-130 cm in diameter.

• For applications such as surface pre-clean and assisted deposition that require high-current, low-energy ions
• Provides improved control of film stress and stoichiometry
• Water-cooled
• Well-suited to precision or industrial optical coating environments
• Flexible integration permits space-saving system design and broad beam angle
• Can be configured with or without filaments, depending upon the process requirements

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