The 3300-series architecture is extremely flexible as the user can have up to 8 chambers per system depending on throughput requirements. In addition, the system is capable of handling multiple wafer sizes and wafer types with minimal hardware modification. Lastly, the process chambers can be stacked vertically leading to extremely low system footprint.

System Architecture

High Volume Platform – 3300 series

• 1 – 10 chamber modular system
• Low footprint- stacked chambers
• On board chemical supply
• Multiple wafer sizes- 50 to 300mm
• Multiple substrate types – Si, LiTaO3, Sapphire, Glass

Manual load platform for R&D – ML

• Single chamber- manual load

                 

WaferStorm 3300 Series Platform                                      Manual Load Platform

Solvent Applications

Metal Lift-Off

• Metal Lift-Off (MLO) is a critical process in the compound semiconductor and RF markets where metals cannot be easily etched without damaging the underlying substrates. The WaferStorm system with ImmJET technology is the market share leader for Metal Lift-Off globally. ImmJET technology is a combination of batch immersion and single wafer spray processing. The immersion step uses heated solvents with agitation. After being softened by the immersion, the wafers are transferred to the single-wafer spray station where they are exposed to high-pressure fan sprays with heated solvents for rapid removal of thick film residue. This combination ensures superior process performance while maintaining the lowest CoO versus wet bench and single wafer solutions.

Photoresist/Dry Film Strip

• The WaferStorm system with ImmJET technology delivers superior process performance and low cost of ownership for the customer for photoresist strip and dry film strip applications. Especially, when the resists are thick and difficult to remove, the combined immersion and high-pressure spray ensures material removal. In addition, proprietary filtration technology enables low downtime and high productivity.

Flux Clean

• In advanced packaging, flux cleaning is critical to both wafer bumping and joint formation processes because it removes oxide layers and other impurities left by solder materials, to ensure a clean metallic interface for the next assembly step. A liquid fluxing agent is delivered to the bumped surface, and additional cleaning steps must be used to remove residues that are left behind. As bump pitches become finer, removing flux residues has become more challenging. Veeco’s proprietary soak-and-spray technology on the WaferStorm platform is especially suited for removal of flux residues from even the tightest spacing.

Scrubber

• 91ÖÆƬ³§PSP’s single and double-sided single wafer cleaning technology achieves high efficiency particle removal for many applications. Veeco’s patented double-sided PVA brush systems cleans top, bottom and side surfaces. Additional single-sided PVA brush scrubbing technologies are available along with High Velocity Spray (HVS) and Megasonics for the most effective cleaning results on all wafer sizes.

TSV Clean

• TSV clean is a critical process step that is essential to reliability. The deep reactive ion etch (DRIE) process leaves behind a polymer residue that can lead to defects and voids in the barrier, seed, and fill steps that follow. The WaferStorm with ImmJET technology relies on the sequential combination of the immersion and high-pressure spray processes to remove residues in high-aspect-ratio holes that wet bench-only or spray-only tools leave behind.

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Key Features

• WaferChek Endpoint – Optical endpoint enables accurate identification of etch endpoint to minimize undercut, improve throughput, and lower chemistry cost.
• Hyperbolic arm scan control- User can tailor the dispense arm pattern to optimize etch uniformity
• Adaptive Spiking- Chemical concentration control to ensure stable etch rate batch to batch and within batch.

System Architecture

High Volume Platform- 3300 series

• 1 – 10 chamber modular system
• Low foot print- stacked chambers
• On board chemical supply
• Multiple wafer sizes- 50 to 300mm
• Multiple substrate types – Si, LiTaO3, Sapphire, Glass

Manual load platform for R&D- ML

• Single chamber- manual load

                      

WaferEtch 3300 Series Platform                                                               Manual Load Platform

Applications

UBM/RDL Etch

• As I/O counts increase and performance requirements become more stringent, the RDL line/space dimensions continue to shrink. To enable these smaller dimensions, superior process control is required. The WaferEtch platform meets these process requirements with WaferChek endpoint and hyperbolic dispense arm motion.

Compound Semiconductor Etch and Silicon Thinning

• As the photonics and power markets continues to grow, manufacturers are scaling up their processes from bench scale to high volume. The WaferEtch system gives users the process control that bench scale approaches cannot, while also providing the wafer size and substrate flexibility.

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