Laser Processing Systems - Veeco /technologies-and-products/laser-processing-systems/ Tue, 05 May 2020 12:17:34 +0000 en-US hourly 1 https://wordpress.org/?v=6.5.3 https://veeco-media-file.s3.amazonaws.com/wp-content/uploads/2020/08/04073652/veeco-favicon.png Laser Processing Systems - Veeco /technologies-and-products/laser-processing-systems/ 32 32 LSA 101 Laser Spike Anneal System /products/lsa-101-laser-spike-anneal-system/ Mon, 30 Mar 2020 07:29:42 +0000 http://miriveeco.com/?post_type=products&p=1275 Chosen by leading IDMs and foundries around the globe Veeco's LSA101 System is preferred technology for high-volume manufacturing of advanced logic devices from 40nm to 14nm nodes

The post LSA 101 Laser Spike Anneal System appeared first on Veeco.

]]>
Installed at leading IDM’s and Foundries globally, Veeco’s LSA101 System is the preferred technology for high-volume manufacturing of advanced logic devices from the 40nm to 14nm nodes. Built on Veeco’s customizable Unity Platform™, LSA 101’s scanning technology delivers fundamental advantages in uniformity and low-stress processing. The LSA101 system enables critical millisecond annealing applications that allow customers to maintain precise, targeted high processing temperatures, and thus achieve gains in device performance, lower leakage, and higher yield.

The standard LSA101 configuration utilizes a single narrow laser beam to heat the wafer surface from substrate temperature to the peak annealing temperature. In response to increasingly complex process demands, 91ÖÆƬ³§developed a dual beam technology which expands the application space of non-melt laser annealing and features a second low-power laser beam to enable low-temperature processing. When using dual beam a second wider laser beam is incorporated to preheat the wafer. The dual beam system offers flexibility in tuning the temperature and stress profiles.

 

The post LSA 101 Laser Spike Anneal System appeared first on Veeco.

]]> LSA 201 Ambient Control Laser Spike Anneal System /products/lsa-201-ambient-control-laser-spike-anneal-system/ Mon, 30 Mar 2020 07:27:45 +0000 http://miriveeco.com/?post_type=products&p=1263 The LSA 201 has the same architecture as the LSA 101, but includes a patented micro chamber design, which enables full-wafer ambient control in a scanning laser system

The post LSA 201 Ambient Control Laser Spike Anneal System appeared first on Veeco.

]]>
Veeco’s LSA201 Laser Spike Annealing (LSA) System has the same architecture as the LSA101 but includes a patented micro chamber design which enables full-wafer ambient control in a scanning laser system. The micro chamber is unique in that it does not require the use of a vacuum load-lock. The system is capable of running mixtures of any inert gases including forming gas. The LSA201 targets applications such as high k metal gate junction activation and nickel silicide formation. The LSA201 is well suited for processes at sub-20nm, such as interface engineering and material modification where ambient control is critical.

Key Features

  • Long wavelength, Brewster angle, p-polarized light for optimum within-die uniformity
  • Closed-loop temperature feedback control to maintain tight temperature control
  • Layout independent design ideal for processing both planer and FinFET devices
  • Localized stress field with flexible dwell time enables low stress processing and reduced wafer breakage

 

The post LSA 201 Ambient Control Laser Spike Anneal System appeared first on Veeco.

]]>